ICEEI 2019

2019 The 4th International Conference on Electronics Engineering and Informatics (ICEEI 2019)--EI Compendex, Scopus

Hong Kong (Hong Kong), 15-17 June 2019


Key deadlines
Conference starts:
2019-06-15
Website

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Conference Description

2019 The 4th International Conference on Electronics Engineering and Informatics (ICEEI 2019)--EI Compendex, Scopus

2019 The 4th International Conference on Electronics Engineering and Informatics (ICEEI 2019) will be held from the 15th to the 17th of June 2019 in Hong Kong.

This conference is organized by Science and Engineering Institute, co organized by Bauman Moscow State technical University, Russia, Tokyo University of Science, Japan and China Agricultural University

Publication and Indexing: As the workshop of WCSE, submissions of ICEEI 2019 will be peer reviewed. Accepted and registered papers will be published in proceedings, which will be indexed by Ei and Scopus. The conference has been running for three consecutive years and was successfully searched by EI, scopus about three months after the meeting.

ICEEI 2018 | Bangkok, Thailand, June 28-30, 2018 | Proceedings 2018, ISBN: 978-981-11-7861-0
ICEEI 2017 | Beijing, China, June 25-27, 2017 | Proceedings 2017, ISBN: 978-981-11-3671-9
ICEEI 2016 | Tokyo, Japan, June 17-19, 2016 | Proceedings 2016, ISBN: 978-981-11-0008-6
More please view: http://iceei.org/

Submission ways:
Send the Full paper & Abstract to submission System: http://confsys.iconf.org/submission/iceei2019

Keynote Speaker
Prof. Hong Lin, University of Houston-Downtown, USA
Prof. Heng Chen, Chinese Academy of Sciences, China
Prof. Hiroaki Fukuda, Shibaura Institute of Technology, Tokyo, Japan
Prof. Li Wenyuan, Southeast University, China

Call for Papers:
Electronics and Communications Engineering
Applied Electronics
Microwave Engineering
Coding and Signal Processing
Informatic and Communication Engineering
For more topics,please visit: http://iceei.org/cfp.html

Conference secretary:
Ms. Amber Lin. [email protected]
Tel: +86-28-8652-8629

Conference creator: Chapman

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Conference Location

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Hong Kong (Hong Kong)

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