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Key deadlines

Conference starts:

2022-05-13

Paper Submission for Revision by:

2022-04-18

Website

Visit the conference website

Conference Description

Conference Proceedings
Accepted and registered papers will be included in Conference Proceedings, which will be indexed by SCOPUS, Ei Compendex.

Publication History
ICEDA 2021 papers have been published in Journal of Physics: Conference Series (Volume 2065)
Indexed by Ei Compendex and Scopus!

Keynote Speakers in 2022:
~Prof. Franco Maloberti, Univeristy of Pavia, Italy
Past President of IEEE Circuits and Systems Society, Life Fellow of IEEE

~Prof. Xianbin Wang, Western University, Canada
Fellow of Canadian Academy of Engineering, Fellow of Engineering Institute of Canada, Fellow of IEEE

~Prof. Massimo Alioto, National University of Singapore, Singapore
Editor in Chief of the IEEE Transactions on VLSI Systems, Fellow of IEEE

~Prof. Qiang Li, University of Electronic Science and Technology of China, China
Distinguished Lecturer of the IEEE Solid-State Circuits Society
Founding Chair of IEEE Chengdu SSCS/CASS Joint Chapter

Invited Speakers Information, please check: http://www.iceda.org/invited.html

Speakers in 2021:
Prof. Juin J. Liou (FIEEE), Shenzhen University, China
Prof. Xiaoqing Wen (FIEEE), Kyushu Institute of Technology, Japan
Prof. Daohua Zhang (FInstP, FIET), Nanyang Technological University, Singapore
Assoc. Prof. Jun Wu, Southeast University, China
Prof. Byung Seong Bae, Hoseo University, Korea
Prof. Razika ZAIR TALA-IGHIL, University M’hamed Bougara of Boumerdes, Algeria

More information about speakers, please visit: http://www.iceda.org/keynote.html

Submission:
You can submit your paper:https://easychair.org/conferences/?conf=iceda2022
For more details, you can learn through: http://www.iceda.org/sub.html

Conference Venue:
Furama City Centre
Add: 60 Eu Tong Sen Street, Pearl's Hill, 059804 Singapore, Singapore
Website: https://www.furama.com/citycentre

more information, please visit : http://www.iceda.org/venue.html

Call for Paper:
CMOS platform technologies
Logic device performance and circuit design challenges
Advanced process integration schemes and scaling approaches
Process module and process control advancements
Device technology co-optimization solutions
SiGe/Ge channel, GAA nanowire and stacked nanosheet
Stacked and monolithic 3D integration
BEOL compatible transistors
--Please check the following link which you can find more topics : http://www.iceda.org/cfp.html

Contact:
Conference Secretary:Ms. Violet Xie
Email: [email protected]
Tel: +86-13103333332 (English&Chinese)
Working Time: Monday - Friday 9:30-18:00 (UTC/GMT+08:00)