ISDEA 2023

2023 2nd International Conference on Intelligent Systems Design and Engineering Applications (ISDEA 2023)

Okayama (Japan), 12-14 May 2023

Key deadlines
Conference starts:
2023-05-12
Paper Submission for Revision by:
2023-03-30
Website

Visit the conference website

Conference Description

Publication:
All accepted papers in the regular oral presentation / poster will be published in ISDEA 2023 conference proceedings and included into Lecture Notes in Electrical Engineering-Springer book series after review, which is indexed by EI Compendex and Scopus databases.

Agenda Overview：
DAY 1 May 12, 2023
10:00 am--17:00 pm Conference Sign in and Materials Collection

DAY 1 May 13, 2023
09:00 am--19:00 pm Keynote session+technical session

DAY 1 May 14, 2023
09:00 am--19:00 pm Keynote session+technical session

Venue：
Okayama University, Japan
Address: １丁目-1-1 Tsushimanaka, Kita Ward, Okayama, 700-8530

Submission Methods:
Full Paper (publication and oral presentation)
Abstract (oral presentation only)
Electronic Submission System: http://confsys.iconf.org/submission/isdea2023
Or you could submit your paper by email directly via [email protected]

Contact:
Ms. Rachel Cao
Email: [email protected]

Conference creator: Vera

Actions menu

Conference Location

image placeholder

Okayama (Japan)

Tags for this conference

Comments

No comments yet!

You must register or sign in to post a comment.